Lead plating method for GMR head manufacture
US7111386B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2005 |
| Grant date | Sep 26, 2006 |
| Priority date | — |
| Expiry date | Nov 3, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A major problem in Lead Overlay design for GMR structures is that the magnetic read track width is wider than the physical read track width. This is due to high interfacial resistance between the leads and the GMR layer which is an unavoidable side effect of prior art methods. The present invention uses electroplating preceded by a wet etch to fabricate the leads. This approach requires only a thin protection layer over the GMR layer to ensure that interface resistance is minimal. Using wet surface cleaning avoids sputtering defects and plating is compatible with this so the cleaned surface is preserved Only a single lithography step is needed to define the track since there is no re-deposition involved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.