Semiconductor device having an alignment mark formed by the same material with a metal post
US7112889B1 · kind B1 · utility
16Cited by
21References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 2000 |
| Grant date | Sep 26, 2006 |
| Priority date | — |
| Expiry date | May 25, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/11
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.