Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization
US7115017B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2006 |
| Grant date | Oct 3, 2006 |
| Priority date | — |
| Expiry date | Mar 31, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/105
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods are provided for controlling adjustable pressure zones of a CMP carrier. A method comprises determining a first thickness of a layer on a wafer underlying a first zone of the carrier. A first portion of the layer underlying the first zone is removed. The first zone is configured to exert a first pressure against the second surface of the wafer. A second thickness of the layer underlying the first zone is determined and a target thickness corresponding to a predetermined thickness profile is selected. A second pressure for the first zone is calculated using the first thickness, the second thickness, the first pressure, and the target thickness. The pressure exerted by the first zone against the second surface of the wafer is adjusted to the second pressure and the steps are repeated for a second zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.