Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices
US7115961B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2004 |
| Grant date | Oct 3, 2006 |
| Priority date | — |
| Expiry date | Aug 24, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Microelectronic imaging devices and methods of packaging microelectronic imaging devices are disclosed herein. In one embodiment, a microelectronic imaging device includes a microelectronic die having an integrated circuit, an image sensor electrically coupled to the integrated circuit, and a plurality of bond-pads electrically coupled to the integrated circuit. The imaging device further includes a cover over the image sensor and a plurality of interconnects in and/or on the cover that are electrically coupled to corresponding bond-pads of the die. The interconnects provide external electrical contacts for the bond-pads of the die. The interconnects can extend through the cover or along a surface of the cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.