Extension of fatigue life for C4 solder ball to chip connection
US7119003B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2005 |
| Grant date | Oct 10, 2006 |
| Priority date | — |
| Expiry date | Jun 8, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3436
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. Thermal strains on the solder member during thermal cycling may be reduced by having a surface area of the pad on the semiconductor substrate exceed a surface area of the pad on the organic substrate. Thermal strains on the solder member during thermal cycling may also be reduced by having a distance from a centerline of the solder member to a closest lateral edge of the semiconductor substrate exceed about 0.25 mm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.