Method and apparatus for fluid delivery to a backside of a substrate
US7128279B2 · kind B2 · utility
1Cited by
9References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2004 |
| Grant date | Oct 31, 2006 |
| Priority date | — |
| Expiry date | Oct 2, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A fluid delivery device for delivering fluid to the backside of a substrate while minimizing waste is provided. The device includes an inner cylindrical tube having a top opening and a bottom opening. An upper cap overlying a top portion of the inner cylindrical tube is included. The upper cap is moveably disposed over the inner cylindrical tube. The upper cap includes a top with at least one hole defined therein. The top includes a sidewall extending therefrom. A system and a method for reducing an amount of a cleaning chemistry applied to a backside of a wafer during a cleaning operation are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.