Method for applying metal features onto barrier layers using electrochemical deposition
US7135404B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2003 |
| Grant date | Nov 14, 2006 |
| Priority date | — |
| Expiry date | Jan 10, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/1089
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to a process for producing structures containing metallized features for use in microelectric workpieces. The process treats a barrier layer to promote the adhesion between the barrier layer and the metallized feature. Suitable means for promoting adhesion between barrier layers and the metallized features according to the invention include an acid treatment of the barrier layer, an electrolytic treatment of the barrier layer, or deposition of a bonding layer between the barrier layer and metallized feature. The present invention thus modifies an exterior surface of a barrier layer making it more suitable for electrodeposition of metal on a barrier, thus eliminating the need for a PVD or CVD seed layer deposition process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.