Method for bonding a pellicle to a patterning device and patterning device comprising a pellicle
US7136152B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 23, 2004 |
| Grant date | Nov 14, 2006 |
| Priority date | — |
| Expiry date | Mar 24, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method is provided to reduce differences between the way in which reticle chucking forces and gravity force act upon the reticle during use and during assembly of the pellicle, and to combine this with a similar reduction concerning pellicle chucking forces and gravity force acting upon the pellicle during bonding to the reticle and during quality control of the pellicle. The shape of the pellicle is measured for control in the same orientation of the pellicle with respect to gravity force as during use of the pellicle, and during bonding the pellicle and the reticle are held in the same way and in the same orientation as during control of the pellicle and use of the reticle in the lithographic apparatus, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.