Wafer processing method
US7138606B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2003 |
| Grant date | Nov 21, 2006 |
| Priority date | — |
| Expiry date | Sep 10, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer processing method for use with a wafer processing apparatus having a liquid cooling jacket with a built-in coolant liquid circulation path and a ceramic plate as attached onto the liquid cooling jacket and having therein a heater and an electrode for an electrostatic chuck. The method enables performance of wafer processing while letting a wafer be mounted on the ceramic plate by a wafer transport. The method includes causing the wafer transport to transport the wafer onto the ceramic plate, pre-heating the wafer while the wafer is held on the ceramic plate for a predetermined length of time, and mounting the preheated wafer on the ceramic plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.