Device having resin package and method of producing the same
US7144754B2 · kind B2 · utility
1Cited by
19References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2004 |
| Grant date | Dec 5, 2006 |
| Priority date | — |
| Expiry date | Sep 27, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device including a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.