Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
US7145221B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2004 |
| Grant date | Dec 5, 2006 |
| Priority date | — |
| Expiry date | Dec 31, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0209
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuitized substrate comprising a first layer comprised of a dielectric material including a low moisture absorptive polymer resin in combination with a nodular fluoropolymer web encased within the resin, the resulting dielectric layer formed from this combination not including continuous or semi-continuous fibers as part thereof. The substrate further includes at least one circuitized layer positioned on the dielectric first layer. An electrical assembly and a method of making the substrate are also provided, as is an information handling system (e.g., computer) incorporating the circuitized substrate of the invention as part thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.