Method and composition for polishing a substrate
US7160432B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2003 |
| Grant date | Jan 9, 2007 |
| Priority date | — |
| Expiry date | May 8, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32134
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique. The electrochemical mechanical polishing technique may include a polishing composition comprising an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, and a solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.