Quad flat flip chip package and leadframe thereof
US7164202B2 · kind B2 · utility
8Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2004 |
| Grant date | Jan 16, 2007 |
| Priority date | — |
| Expiry date | Nov 15, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A quad flat flip chip package and a leadframe therefor are provided. A bump connection part is defined by bending or etching the leads of the leadframe. Thus, the bump formed after a reflow process is limited within the bump connection part, and the collapse of the bump can be prevented. Moreover, and the manufacturing costs of the package can be decreased and the process thereof can be simplified.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.