Heat dissipation for heat generating element of semiconductor device and related method
US7166913B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2005 |
| Grant date | Jan 23, 2007 |
| Priority date | — |
| Expiry date | Apr 19, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure and method are disclosed for heat dissipation relative to a heat generating element in a semiconductor device. The structure includes a plurality of heat transmitting lines partially vertically coincidental with the heat generating element, and at least one interconnecting path from each heat transmitting line to a substrate of the semiconductor device. In one embodiment, the heat generating element includes a resistor in a non-first metal level. The invention is compatible with conventional BEOL interconnect schemes, minimizes the amount of heat transfer from the resistor to the surrounding interconnect wiring, thus eliminating the loss of current carrying capability in the wiring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.