Tom C. Lee
75Patents
9h-index
71Co-inventors
77Inventor score
Filing activity: Nov 4, 2003 → Jun 25, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7786535B2 | Design structures for high-voltage integrated circuits | Electricity | 244 | Active |
| US7397260B2 | Structure and method for monitoring stress-induced degradation of conductive interconnects | Electricity | 167 | Expired |
| US7166913B2 | Heat dissipation for heat generating element of semiconductor device and related method | Electricity | 34 | Expired |
| US7892926B2 | Fuse link structures using film stress for programming and methods of manufacture | Electricity | 16 | Active |
| US8563336B2 | Method for forming thin film resistor and terminal bond pad simultaneously | Electricity | 15 | Active |
| US8021950B1 | Semiconductor wafer processing method that allows device regions to be selectively annealed following back end of the line (BEOL) metal wiring layer formation | Electricity | 15 | Active |
| US8445355B2 | Metal-insulator-metal capacitors with high capacitance density | Electricity | 15 | Active |
| US7345503B2 | Method and apparatus for impedance matching in transmission circuits using tantalum nitride resistor devices | Electricity | 10 | Active |
| US8637388B2 | Semiconductor device heat dissipation structure | Electricity | 9 | Active |
| US8841174B1 | Silicon controlled rectifier with integral deep trench capacitor | Electricity | 9 | Active |
| US8236655B2 | Fuse link structures using film stress for programming and methods of manufacture | Electricity | 8 | Active |
| US8101505B2 | Programmable electrical fuse | Electricity | 8 | Active |
| US8089105B2 | Fuse link structures using film stress for programming and methods of manufacture | Electricity | 8 | Active |
| US9064786B2 | Dual three-dimensional (3D) resistor and methods of forming | Electricity | 7 | Active |
| US8760831B2 | Bi-directional back-to-back stacked SCR for high-voltage pin ESD protection, methods of manufacture and design structures | Electricity | 6 | Active |
| US8592941B2 | Fuse structure having crack stop void, method for forming and programming same, and design structure | Electricity | 5 | Active |
| US9240471B2 | SCR with fin body regions for ESD protection | Electricity | 5 | Active |
| US7768815B2 | Optoelectronic memory devices | Physics | 4 | Active |
| US8610249B2 | Non-planar capacitor and method of forming the non-planar capacitor | Electricity | 4 | Active |
| US8562210B2 | Thermal sensor for semiconductor circuits | Physics | 4 | Active |
| US7512506B2 | IC chip stress testing | Physics | 4 | Active |
| US8891212B2 | RC-triggered semiconductor controlled rectifier for ESD protection of signal pads | Emerging Cross-Sectional Technologies | 4 | Active |
| US8686508B2 | Structures, methods and applications for electrical pulse anneal processes | Electricity | 4 | Active |
| US8669146B2 | Semiconductor structures with thinned junctions and methods of manufacture | Electricity | 4 | Active |
| US9006783B2 | Silicon controlled rectifier with integral deep trench capacitor | Electricity | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.