Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methods
US7169248B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2005 |
| Grant date | Jan 30, 2007 |
| Priority date | — |
| Expiry date | Jul 19, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1471
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methods. A method for processing a microfeature workpiece in accordance with one embodiment includes applying adhesive material to a non-active portion on a first side of a workpiece. The workpiece can include a first active portion and a second active portion separated from each other at least in part by the non-active portion. The method continues by adhesively attaching the first side of the workpiece to a first support member, and releasably attaching the second side of the workpiece to a second support member. The method further includes separating the first active portion from the second active portion while the workpiece is attached to the second support member by cutting through the first support member and the non-active portion of the workpiece. The separation process removes at least approximately all the adhesive material from the non-active portion of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.