Lead-frame method and assembly for interconnecting circuits within a circuit module
US7176062B1 · kind B1 · utility
0Cited by
238References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2005 |
| Grant date | Feb 13, 2007 |
| Priority date | — |
| Expiry date | Mar 31, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.