System and method for performing semiconductor processing on substrate being processed
US7179334B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2002 |
| Grant date | Feb 20, 2007 |
| Priority date | — |
| Expiry date | Mar 19, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/136
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor process system (10) includes a measuring section (40), an information processing section (51), and a control section (52). The measuring section (40) measures a characteristic of a test target film formed on a target substrate (W) by a semiconductor process. The information processing section (51) calculates a positional correction amount of the target substrate (W) necessary for improving planar uniformity of the characteristic, based on values of the characteristic measured by the measuring section (40) at a plurality of positions on the test target film. The control section (52) controls a drive section (30A, 32A) of a transfer device (30), based on the positional correction amount, when the transfer device (30) transfers a next target substrate (W) to the support member (17) to perform the semiconductor process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.