Plasma chamber wall segment temperature control
US7186313B2 · kind B2 · utility
1Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2004 |
| Grant date | Mar 6, 2007 |
| Priority date | — |
| Expiry date | Oct 16, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67069
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device and method for controlling the temperature of a plasma chamber inside wall or other surfaces exposed to the plasma by a plurality of temperature control systems. A plasma process within the plasma chamber can be controlled by independently controlling the temperature of segments of the wall or other surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.