Metrology for chemical mechanical polishing
US7195535B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2005 |
| Grant date | Mar 27, 2007 |
| Priority date | — |
| Expiry date | Jul 22, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/345
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods and apparatus for providing metrology for chemical mechanical polishing. A chemical mechanical polishing system includes a first polishing station, a second polishing station, a transport device, and a first measuring station. The transport device is configured to hold a workpiece during polishing at the first and second polishing stations and to move the workpiece from the first polishing station to the second polishing station. The first measuring station is situated to measure a characteristic of the workpiece when the transport device is holding the workpiece and when the workpiece is not in contact with a polishing pad of any of the first polishing station and the second polishing station.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.