Embedded probe-enabling socket with integral probe structures
US7202685B1 · kind B1 · utility
4Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2005 |
| Grant date | Apr 10, 2007 |
| Priority date | — |
| Expiry date | Nov 30, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/31705
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of testing and an embedded probe-enabling socket are provided for implementing debug and testing functions. The socket includes an integral probe structure enabling Top Side of the Module (TSM) signal probing. The socket includes a substrate with a topside including a plurality of probe pads. A TSM socket frame includes a plurality of probe pins electrically connecting to respective probe pads on the substrate topside. The probe pins are electrically connected with a respective signal to be monitored.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.