Lift pin assembly for substrate processing
US7204888B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 1, 2003 |
| Grant date | Apr 17, 2007 |
| Priority date | — |
| Expiry date | Aug 18, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention provide an apparatus for constraining and supporting the lift pins to prevent or minimize lateral movement of the lift pins that causes substrate hand-off problems and associated degradation in substrate processing characteristics and results. In one embodiment, a lift pin assembly for manipulating a substrate above a support surface of a substrate support comprises a plurality of lift pins movable between an up position and a down position. The lift pins include top ends and bottom ends. The top ends are configured to be lifted above the support surface of the substrate support to contact a bottom surface of the substrate in the up position. The top ends are configured to be positioned at or below the support surface of the substrate support in the down position. A lift pin connecting member is attached to the plurality of lift pins at attachment locations at or near the bottom ends of the lift pins to maintain fixed relative distances between the lift pins at the attachment locations and to move with the lift pins between the up position and the down position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.