Conductive polishing article for electrochemical mechanical polishing

US7207878B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Yongqi Hu · Campbell, US
• Yan Wang · Chongqing, CN
• Alain Duboust · Sunnyvale, US
• Feng Q. Liu · San Jose, US
• Antoine P. Manens · Palo Alto, US
• Siew Neo · Sunnyvale, US
• Stan Tsai · Clifton Park, US
• Liang-Yuh Chen · San Jose, US
• Paul D. Butterfield · San Jose, US
• Yuan Tian · Alameda, US
• Sen-Hou Ko · Cupertino, US

Key dates

• Filing date: Jan 8, 2005
• Grant date: Apr 24, 2007
• Expiry date: Jan 16, 2025

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/249924
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.