Power semiconductor package
US7208818B2 · kind B2 · utility
27Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2004 |
| Grant date | Apr 24, 2007 |
| Priority date | — |
| Expiry date | Jul 20, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package including a relatively thick lead frame having a plurality of leads and a first lead frame pad, the first lead frame pad including a die coupled thereto, bonding wires connecting the die to the plurality of leads, the bonding wires being aluminum, and a resin body encapsulating the die, bonding wires and at least a portion of the lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.