Substrate support element for an electrochemical plating cell
US7214297B2 · kind B2 · utility
28Cited by
46References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2004 |
| Grant date | May 8, 2007 |
| Priority date | — |
| Expiry date | Aug 5, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/06
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A contact ring for an electrochemical plating system is provided. The contact ring includes an annular substrate supporting member, a plurality of radially positioned conductive substrate contact pins extending from the substrate supporting member, an annular conductive thief element attached to the substrate supporting member, and at least one source of electrical power in electrical communication with the contact pins and the conductive thief element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.