Composite alignment mark scheme for multi-layers in lithography
US7221060B1 · kind B1 · utility
2Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2005 |
| Grant date | May 22, 2007 |
| Priority date | — |
| Expiry date | Aug 23, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/975
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Systems and/or methods are disclosed for aligning multiple layers of a multi-layer semiconductor device fabrication process and/or system utilizing a composite alignment mark. A component is provided to form the composite alignment mark, such that a first portion of the composite alignment mark is associated with a layer of the wafer and a second portion of the composite alignment mark is associated with a disparate layer of the wafer. An alignment component is utilized to align a reticle for a layer to be patterned to the composite alignment mark.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.