Apparatus to improve wafer temperature uniformity for face-up wet processing
US7223308B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2003 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | Jan 5, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/1678
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for controlling a substrate temperature during an electroless deposition process. The apparatus includes a deposition cell configured to support a substrate at a position above a fluid distribution member. A heated fluid is dispensed from the fluid distribution member and contacts the backside of the substrate, thus heating the substrate. The fluid is dispensed from apertures configured to maintain a constant temperature across the substrate surface. The method includes flowing a heated fluid through a diffusion member against a backside of the substrate in a configuration that is configured to generate a constant processing temperature across the front side or processing side of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.