Methods for packaging a plurality of semiconductor dice using a flowable dielectric material
US7235431B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2004 |
| Grant date | Jun 26, 2007 |
| Priority date | — |
| Expiry date | Sep 2, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12041
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of packaging at least a portion of a semiconductor die or dice is disclosed. Uncured material may be disposed proximate at least the periphery of at least one semiconductor die and at least partially cured substantially as a whole. Methods of forming conductive elements such as traces, vias, and bond pads are also disclosed. More specifically, forming at least one organometallic layer to a substrate surface and selectively heating at least a portion thereof is disclosed. Also, forming a layer of conductive photopolymer over at least a portion of a surface of a substrate and removing at least a portion thereof is disclosed. A microlens having a plurality of mutually adhered layers of cured, optically transmissive material, methods of forming same, and systems so equipped are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.