Method for separating wafers bonded together to form a stacked structure

US7264996B2 · kind B2 · utility

Assignee

• COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

• Hubert Moriceau · Saint-Égrève, FR
• Frank Fournel · Meylan, FR
• Bernard Aspar · Voiron, FR

Key dates

• Filing date: Sep 23, 2004
• Grant date: Sep 4, 2007
• Expiry date: Sep 23, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/76254
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

This invention relates to a method for separating at least two wafers (1, 2) bonded together to form a stacked structure. At least one bending force is applied to all or part of the stacked structure to separate the stacked structure into two parts along a required separation plane.Application particularly for producing a thin semiconducting layer.