Semiconductor device and its manufacturing method
US7265035B2 · kind B2 · utility
10Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2003 |
| Grant date | Sep 4, 2007 |
| Priority date | — |
| Expiry date | Aug 26, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68327
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To improve the reliability and yield of a thin-type semiconductor device as used for a stack-type flash memory, the semiconductor device is manufactured by upheaving each of semiconductor chips (semiconductor devices) obtained by dicing a semiconductor wafer on an adhesive sheet from a backside via the adhesive sheet using an upthrow jig to which ultrasonic vibration is applied so as not to break through the adhesive sheet, and by picking up each semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.