Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
US7274004B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2004 |
| Grant date | Sep 25, 2007 |
| Priority date | — |
| Expiry date | Nov 30, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chuck for a plasma processor comprises a temperature-controlled base, a thermal insulator, a flat support, and a heater. The temperature-controlled base has a temperature below the desired temperature of a workpiece. The thermal insulator is disposed over the temperature-controlled base. The flat-support holds a workpiece and is disposed over the thermal insulator. A heater is embedded within the flat support and/or disposed on an underside of the flat support. The heater includes a plurality of heating elements that heat a plurality of corresponding heating zones. The power supplied and/or temperature of each heating element is controlled independently.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.