Systems and methods for measuring stress in a specimen
US7274440B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2004 |
| Grant date | Sep 25, 2007 |
| Priority date | — |
| Expiry date | Apr 28, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods for measuring stress in a specimen are provided. One system includes an optical subsystem configured to measure stress-induced birefringence in patterned structures formed on the specimen. In some embodiments, the optical subsystem may be configured as a spectroscopic ellipsometer, a multi-angle laser ellipsometer, a polarimeter, a polarized reflectometer, or some combination thereof. The system also includes a processor coupled to the optical subsystem. The processor is configured to determine stress in a material of the patterned structures using the stress-induced birefringence measurements. One method includes measuring stress-induced birefringence in patterned structures formed on the specimen using an optical technique. The method also includes determining stress in a material of the patterned structures using the stress-induced birefringence measurements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.