Electronic component with a plastic package and method for production

US7276783B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Bernd Goller · Otterfing, DE
• Robert-Christian Hagen · Sarching, DE
• Gerald Ofner · Regensburg, DE
• Christian Stuempfl · Schmidgaden, DE
• Josef Thumbs · Johanngeorgenstadt, DE
• Stefan Wein · Regensburg, DE
• Holger Woerner · Regensburg, DE

Key dates

• Filing date: Jul 31, 2002
• Grant date: Oct 2, 2007
• Expiry date: May 6, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/18162
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of the semiconductor chip and wiring lines arranged on the plastic package molding compound. In this case, the contact pillars represent an electrically conducting elevation of the contact areas.