Patent · US Expired

Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof

US7276785B2 · kind B2 · utility

65Cited by

3References

10Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Wolfram Eurskens · Unterhaching, DE
Gerold Gruendler · Regensburg, DE
Rudolf Kerler · Lappersdorf, DE
Heinz Pape · Aschheim, DE
Peter Strobel · Regensburg, DE

Key dates

Filing date	Sep 7, 2004
Grant date	Oct 2, 2007
Priority date	—
Expiry date	Dec 10, 2024

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19105
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.