Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices
US7282397B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2006 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | Feb 17, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A rerouting element for a semiconductor device includes a substantially planar member that carries at least one contact location, at least one conductive, at least one rerouted bond pad. The contact location is positioned adjacent to a first periphered edge of the substantially planar member and at a location that corresponds to the location of a bond pad of a semiconductor device with which the rerouting element is to be used. The at least one conductive element, which communicates with the at least one contact location, reroutes the bond pad location of the semiconductor device to a corresponding rerouted bond pad location adjacent to a second one peripheral edge of the rerouted substantially planar member which is opposite the first periphered edge. In addition, assemblies including rerouting elements and methods for designing and using rerouting elements are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.