Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element
US7282805B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2006 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | Jan 4, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A rerouting element for a semiconductor device includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerouting element is to be used. The conductive elements, which communicate with corresponding conductive vias, reroute the bond pad locations to corresponding contact pad locations adjacent to one peripheral edge or two adjacent peripheral edges of the rerouted semiconductor device. The rerouting element is particularly useful for rerouting centrally located bond pads of a semiconductor device, as well as for rerouting the peripheral locations of bond pads of a semiconductor device to one or two adjacent peripheral edges thereof. In addition, methods for designing and using rerouting elements are disclosed. Semiconductor device assemblies including one or more rerouting elements that provide contacts adjacent to one or two adjacent peripheral edges of a semiconductor die are also disclosed, as are semiconductor device assemblies in which contacts adjacent to two or more peripheral edges of a lower semiconduc…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.