Apparatus and methods for searching through and analyzing defect images and wafer maps
US7283659B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2002 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | Feb 28, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are methods and apparatus for automatically organizing and/or analyzing a plurality of defect images without first providing a predefined set of classified images (herein referred to as a training set). In other words, sorting is not based on a training set or predefined classification codes for such defect images. In one embodiment, the defect images each include associated identifying data, such as a fabrication identifier, lot number, wafer number, and layer identifier. Initially, the defect images are sorted according to at least a portion of the associated identifying data into a plurality of “identifying data groups” or image families. The defect data in each identifying data group is then automatically sorted according to defect appearance. That is, similar defect images are associated with a single bin and similar bins are associated with other similar bins. For example, similar bins are arranged next to each other within a graphical user interface (GUI). A representative feature vector (herein referred to as a “centroid”) is then associated with each bin. The centroid generally represents the images within the particular bin. A search for images that “look like” …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.