Method of alignment for efficient defect review
US7294833B2 · kind B2 · utility
9Cited by
1References
5Claims
0Family size
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Key dates
| Filing date | May 19, 2004 |
| Grant date | Nov 13, 2007 |
| Priority date | — |
| Expiry date | Jun 12, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2817
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An inspection system includes a SEM visual inspection apparatus for detecting a defect in a semiconductor sample in steps of manufacturing a semiconductor device and a review apparatus for observing, at a high resolution, the defect in the semiconductor sample detected by the SEM visual inspection apparatus. The system has a function of transmitting an alignment dictionary image as one of alignment parameters to be set by the SEM visual inspection apparatus using an inspection recipe to the review apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.