Chemical mechanical polishing apparatus with rotating belt
US7303467B2 · kind B2 · utility
9Cited by
43References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2006 |
| Grant date | Dec 4, 2007 |
| Priority date | — |
| Expiry date | Sep 12, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing apparatus has a movable platen, a drive mechanism and a chucking mechanism. The drive mechanism is attached to the platen, is configured to support a generally linear polishing sheet with a portion of the polishing sheet extending over the platen, and is configured to incrementally advance the polishing sheet in a linear direction relative to the platen. The chucking mechanism is configured to intermittently secure the portion of the polishing sheet to the platen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.