Heating apparatus to heat wafers using water and plate with turbolators
US7311779B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2003 |
| Grant date | Dec 25, 2007 |
| Priority date | — |
| Expiry date | Jan 24, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/288
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Embodiments of the invention provide a fluid processing method and apparatus. The apparatus includes a substrate support assembly positioned in a processing volume, a disk shaped member positioned in the processing volume in parallel orientation with a substrate supported on the substrate support assembly, a fluid outlet positioned in a central location of the disk shaped member, and a plurality of turbolators positioned on an upper surface of the disk shaped member, the turbolators being configured to generate a uniform turbulent flow of fluid traveling from the fluid outlet to a perimeter of the substrate. The method includes flowing a heated processing fluid over a plurality of turbolators that are positioned under a substrate being processed to control the temperature of the substrate during processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.