Compliant electrical contacts
US7316572B2 · kind B2 · utility
4Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2005 |
| Grant date | Jan 8, 2008 |
| Priority date | — |
| Expiry date | Feb 3, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming compliant electrical contacts includes patterning a conductive layer into an array of compliant members. The array of compliant members is then positioned to be in contact with electrical connection pads on an integrated circuit wafer and the compliant members are joined to the pads. Then, the supporting layer that supported the compliant members is removed to leave the compliant members connected to the pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.