David E. Eichstadt
14Patents
4h-index
34Co-inventors
60Inventor score
Filing activity: Oct 26, 2000 → Jul 9, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6468413B1 | Electrochemical etch for high tin solder bumps | Electricity | 11 | Expired |
| US7144490B2 | Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer | Electricity | 7 | Expired |
| US7332821B2 | Compressible films surrounding solder connectors | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7316572B2 | Compliant electrical contacts | Emerging Cross-Sectional Technologies | 4 | Expired |
| US7566649B2 | Compressible films surrounding solder connectors | Emerging Cross-Sectional Technologies | 4 | Active |
| US6995475B2 | I/C chip suitable for wire bonding | Electricity | 3 | Expired |
| US6995084B2 | Method for forming robust solder interconnect structures by reducing effects of seed layer underetching | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6992389B2 | Barrier for interconnect and method | Electricity | 2 | Expired |
| US7473997B2 | Method for forming robust solder interconnect structures by reducing effects of seed layer underetching | Emerging Cross-Sectional Technologies | 2 | Active |
| US12031851B2 | Actuator apparatus with light actuated position sensor and secure position verification | Physics | 1 | Active |
| US7572726B2 | Method of forming a bond pad on an I/C chip and resulting structure | Electricity | 0 | Active |
| US12416513B2 | Actuator apparatus with light actuated position sensor and secure position verification | Physics | 0 | Active |
| US7767575B2 | Forming robust solder interconnect structures by reducing effects of seed layer underetching | Emerging Cross-Sectional Technologies | 0 | Active |
| US6900142B2 | Inhibition of tin oxide formation in lead free interconnect formation | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.