Capacitor constructions and rugged silicon-containing surfaces
US7321148B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2004 |
| Grant date | Jan 22, 2008 |
| Priority date | — |
| Expiry date | Mar 12, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/964
Abstract
The invention encompasses a method of forming a rugged silicon-containing surface. A layer comprising amorphous silicon is provided within a reaction chamber at a first temperature. The temperature is increased to a second temperature at least 40° C. higher than the first temperature while flowing at least one hydrogen isotope into the chamber. After the temperature reaches the second temperature, the layer is seeded with seed crystals. The seeded layer is then annealed to form a rugged silicon-containing surface. The rugged silicon-containing surface can be incorporated into a capacitor construction. The capacitor construction can be incorporated into a DRAM cell, and the DRAM cell can be utilized in an electronic system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.