Multi-part lead frame
US7321160B2 · kind B2 · utility
3Cited by
31References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 2005 |
| Grant date | Jan 22, 2008 |
| Priority date | — |
| Expiry date | Jul 3, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-part lead frame semiconductor device assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame semiconductor device assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.