Apparatus for electroless deposition of metals onto semiconductor substrates
US7323058B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2004 |
| Grant date | Jan 29, 2008 |
| Priority date | — |
| Expiry date | Nov 22, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electroless deposition system is provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station includes an environmentally controlled processing enclosure, a first processing station configured to clean and activate a surface of a substrate, a second processing station configured to electrolessly deposit a layer onto the surface of the substrate, and a substrate transfer shuttle positioned to transfer substrates between the first and second processing stations. The system also includes a substrate transfer robot positioned on the mainframe and configured to access an interior of the processing enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.