Method and composition for polishing a substrate
US7323416B2 · kind B2 · utility
12Cited by
141References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2005 |
| Grant date | Jan 29, 2008 |
| Priority date | — |
| Expiry date | Aug 23, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/7684
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique, and then polishing the substrate by at least a chemical mechanical polishing technique.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.