Enhanced wafer cleaning method
US7329321B2 · kind B2 · utility
6Cited by
0References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2005 |
| Grant date | Feb 12, 2008 |
| Priority date | — |
| Expiry date | Feb 17, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for removing post-processing residues in a single wafer cleaning system is provided. The method initiates with providing a first heated fluid to a proximity head disposed over a substrate. Then, a meniscus of the first fluid is generated between a surface of the substrate and an opposing surface of the proximity head. The substrate is linearly moved under the proximity head. A single wafer cleaning system is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.