Fluxless solder transfer and reflow process
US7332424B2 · kind B2 · utility
20Cited by
22References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2005 |
| Grant date | Feb 19, 2008 |
| Priority date | — |
| Expiry date | Sep 25, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/128
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a new process that permits the transfer and reflow of solder features produced by Injection Molded Solder (IMS) from a mold plate to a solder receiving substrate without the use of flux. Several embodiments produce solder transfer and reflow separately or together and use either formic acid vapor or partial concentration of hydrogen, both in nitrogen, as the oxide reducing atmosphere. A final embodiment produces fluxless transfer and reflow in only nitrogen through the use of ultrasonic vibration between the solder filled mold plate and solder receiving substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.