Bonding of light emitting diodes having shaped substrates
US7341175B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2004 |
| Grant date | Mar 11, 2008 |
| Priority date | — |
| Expiry date | Jun 30, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Bonding of flip-chip mounted light emitting devices having an irregular configuration is provided. Light emitting diodes having a shaped substrate are bonded to a submount by applying forces to the substrate an a manner such that shear forces within the substrate do not exceed a failure threshold of the substrate. Bonding a light emitting diode to a submount may be provided by applying force to a surface of a substrate of the light emitting diode that is oblique to a direction of motion of the light emitting diode to thermosonically bond the light emitting diode to the submount. Collets for use in bonding shaped substrates to a submount and systems for bonding shaped substrates to a submount are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.