Methods for the electrochemical deposition of copper onto a barrier layer of a work piece
US7341946B2 · kind B2 · utility
9Cited by
10References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2003 |
| Grant date | Mar 11, 2008 |
| Priority date | — |
| Expiry date | Apr 21, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76877
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods are provided for electrochemically depositing copper on a work piece. One method includes the step of depositing overlying the work piece a barrier layer having a surface and subjecting the barrier layer surface to a surface treatment adapted to facilitate deposition of copper on the barrier layer. Copper then is electrochemically deposited overlying the barrier layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.